MacroFab Engineering Podcast EP 281

Through Hole Manufacturing

June 17, 2021 Hosted by Parker Dillmann, Stephen Kraig

Through hole assembly for PCBs might be great for low volume prototypes but how do you scale up that process? What design considerations are needed?

Through Hole Manufacturing

Processes
- Hand Soldering
- Soldering “robot”
- Wave soldering
  - Design Criteria
  - Pallets
- Selective soldering
  - Design Criteria
  - Keepouts
Lead Forming
- Pre purchase?
- Forming with a die?
- Using hand tools?
PCB design
- Holes
- Non circular?
- Annular rings
- IPC stuff
  - IPC-2221 Generic Standard on Printed Board Design
  - IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards
  - IPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
  - IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard
    - Performance Classification (1,2,3)
    - Producibility Levels (A,B,C)
    - Land Pattern Determination (Density level A,B,C)

Hosts: Parker Dillmann, Stephen Kraig

Special thanks to whixr over at Tymkrs for the intro and outro!